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Lamination

Our starch-based adhesives for lamination offer greater cardboard flatness and strength and reduce indentations

 


Modexcol

Liquid adhesives formulated with modified starch, specially designed for lamination applications. The Modexcol line includes different formulations that vary in terms of their dry-solid content and viscosity to best meet the needs of each client.

Collfix

Very high-tack liquid adhesive specially designed for high-speed machines.


Facilities

Our production plant is located in Sant Andreu de la Barca, an industrial municipality 25 km from Barcelona.

See facilities
For more information:

Contact us

MODIFICADOS Y DEXTRINAS, S.A.
c. Granada, 10-12 08740
Sant Andreu de la Barca
Barcelona - SPAIN
Phone: 00 34 93 682 56 60
e-mail: comercial@modexsa.com